THERMAL FATIGUE IN SOLDER JOINTS

被引：41
|
作者：
FREAR, DR
GRIVAS, D
MORRIS, JW
机构：
[1] UNIV CALIF BERKELEY,MET,BERKELEY,CA 94720
[2] UNIV CALIF BERKELEY LAWRENCE BERKELEY LAB,CTR ADV MAT,BERKELEY,CA 94720
来源：
JOURNAL OF METALS | 1988年 / 40卷 / 06期
关键词：
D O I：
10.1007/BF03258168
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：18 / 22
页数：5
相关论文
共 50 条
  • [1] THERMAL FATIGUE IN SOLDER JOINTS.
    Frear, D.R.
    Grivas, Dennis
    Morris Jr., J.W.
    Journal of Metals, 1988, 40 (06): : 18 - 22
  • [2] The role of microstructure in the thermal fatigue of solder joints
    Xian, J. W.
    Xu, Y. L.
    Stoyanov, S.
    Coyle, R. J.
    Dunne, F. P. E.
    Gourlay, C. M.
    NATURE COMMUNICATIONS, 2024, 15 (01)
  • [3] A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
    Borgesen, Peter
    Wentlent, Luke
    Hamasha, Sa'd
    Khasawneh, Saif
    Shirazi, Sam
    Schmitz, Debora
    Alghoul, Thaer
    Greene, Chris
    Yin, Liang
    JOURNAL OF ELECTRONIC MATERIALS, 2018, 47 (05) : 2526 - 2544
  • [4] A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
    Peter Borgesen
    Luke Wentlent
    Sa’d Hamasha
    Saif Khasawneh
    Sam Shirazi
    Debora Schmitz
    Thaer Alghoul
    Chris Greene
    Liang Yin
    Journal of Electronic Materials, 2018, 47 : 2526 - 2544
  • [5] A DAMAGE INTEGRAL APPROACH TO THERMAL FATIGUE OF SOLDER JOINTS
    SUBRAHMANYAN, R
    WILCOX, JR
    LI, CY
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04): : 480 - 491
  • [6] Thermal fatigue modelling for SnAgCu and SnPb solder joints
    Dudek, R
    Walter, H
    Doering, R
    Michel, B
    THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, 2004, : 557 - 564
  • [7] Predicting thermal fatigue lifetimes for SMT solder joints
    Sauber, J.
    Seyyedi, J.
    Journal of Electronic Packaging, Transactions of the ASME, 1992, 114 (04): : 472 - 476
  • [8] Thermal fatigue mechanisms of CSP solder joints on PWB
    Ohta, H
    Nishimura, N
    NEC RESEARCH & DEVELOPMENT, 2003, 44 (03): : 246 - 250
  • [9] Numerical simulation for the Thermal Fatigue of Flip Chip Solder Joints
    Lin, Y. C.
    Lu, Jing-Hong
    Zhang, Jun
    MANUFACTURING SCIENCE AND ENGINEERING, PTS 1-5, 2010, 97-101 : 3963 - +
  • [10] ANALYSIS OF THERMAL CYCLE FATIGUE DAMAGE IN MICROSOCKET SOLDER JOINTS
    LEVINE, E
    ORDONEZ, J
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 515 - 519
12345