共 50 条
- [31] Thermal Cycle Fatigue Life Prediction for Flip Chip Solder Joints 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 703 - 711
- [33] A STUDY ON PARAMETERS THAT IMPACT THE THERMAL FATIGUE LIFE OF BGA SOLDER JOINTS PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022, 2022,
- [35] Reliability and thermal fatigue life prediction of solder joints using nanoindentation MATERIALS TODAY COMMUNICATIONS, 2024, 39
- [36] Influence of Reflow Profile on Thermal Fatigue Behaviors of Solder Ball Joints Journal of Materials Engineering and Performance, 2020, 29 : 4095 - 4104
- [38] THERMAL CYCLING FATIGUE ANALYSIS OF SAC387 SOLDER JOINTS 2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
- [39] Effects of combined cyclic thermal and mechanical loading on fatigue of solder joints ITHERM 2004, VOL 2, 2004, : 280 - 286