共 50 条
- [41] Thermal fatigue life prediction of solder joints using stress analysis 1ST 1997 IEMT/IMC SYMPOSIUM, 1997, : 204 - 208
- [42] Long-Term Thermal Fatigue Testing of Solder Joints and Related Fatigue Life Predictions 2018 19TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2018,
- [44] Influence of silver nanopowders addition to the SAC solder paste on thermal and mechanical fatigue properties of solder joints PRZEGLAD ELEKTROTECHNICZNY, 2012, 88 (11B): : 79 - 82
- [46] Reliability and thermal fatigue life prediction of solder joints for advanced automotive microelectronics Journal of Mechanical Science and Technology, 2021, 35 : 3633 - 3641
- [47] A FRACTURE-MECHANICS APPROACH TO THERMAL FATIGUE LIFE PREDICTION OF SOLDER JOINTS IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (04): : 559 - 570
- [48] Study on the Effect of Manual Splitting on Thermal Fatigue Reliability of PBGA Solder Joints 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
- [49] Thermal shock fatigue enhancement of solder joints by using novel reinforcing fabrics 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
- [50] Finite Element Modeling on Thermal Fatigue of BGA Solder Joints with Multiple Voids 2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY, 2011, : 380 - 385