Configurable in-memory computing architecture based on dual-port SRAM

被引:1
|
作者
Zhao, Yue [1 ]
Liu, Yunlong [1 ]
Zheng, Jian [1 ]
Tong, Zhongzhen [2 ]
Wang, Xin [1 ]
Yu, Runru [1 ]
Wu, Xiulong [1 ]
Zhou, Yongliang [1 ]
Peng, Chunyu [1 ]
Lu, Wenjuan [1 ]
Zhao, Qiang [1 ]
Lin, Zhiting [1 ]
机构
[1] Anhui Univ, Hefei 230601, Peoples R China
[2] Beihang Univ, Beijing 100191, Peoples R China
基金
中国国家自然科学基金;
关键词
Static random access memory (SRAM); In-memory computing (IMC); Von Neumann bottleneck; Multiply and accumulate (MAC); XOR; UNIT-MACRO; COMPUTATION; PRECISION;
D O I
10.1016/j.mejo.2024.106163
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In the emerging field of in-memory computing (IMC), this study proposes a dual-port static random access memory (SRAM) IMC architecture with the distinct capability of realizing XOR encryption (XORE), thus serving as a potential solution for the Von Neumann bottleneck. Beyond providing traditional SRAM read and write operations, the proposed architecture carries out additional tasks such as multi-bit multiply and accumulate (MAC) and XOR accumulation (XORA). The architecture was simulated using a 28-nm Complementary Metal Oxide Semiconductor Process, demonstrating a minor standard deviation of 9.41 mV in bit line voltage at the SS process corner, as evidenced by Monte Carlo simulation. Energy expenditure for the MAC, XORA, and XORE, was found to be 1.65, 1.46, and 9.02 fJ/ops respectively at the TT process corner. Furthermore, the presented architecture showed considerable energy efficiency, with MAC, XORA, and XORE operations achieving energy efficiency values of 604.9, 682.7, and 110.8 TOPS/W respectively, at a supply voltage of 0.9 V at the TT process corner.
引用
收藏
页数:9
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