Research on the Application of Microscopic Analysis Technology in PCB Inspection and Failure Analysis

With the development of PCB to high density and high reliability, the traditional microsection and scanning electron microscopy (SEM) observation methods are difficult to meet the current microscopic analysis needs, so FIB-SEM, EBSD, TEM and other microscopic analysis technologies in the quality inspection and failure analysis of PCB products have begun to be widely used. This paper briefly introduces the principles of FIB-SEM, EBSD, TEM and typical applications in the PCB field, and combines specific PCB product failure examples to conduct technical research on the practical application of microscopic analysis methods in HDI board blind hole bottom separation and FPC conductor fracture, pointing out the advantages and shortcomings of various analysis techniques, and has reference significance for PCB failure analysis, quality inspection and production process control.