Dry-Contact Thermal Interface Material with the Desired Bond Line Thickness and Ultralow Applied Thermal Resistance

被引：0
|
作者：
Dou, Zhengli [1 ]
Zhang, Bin [1 ]
Xu, Pengfei [2 ]
Fu, Qiang [1 ]
Wu, Kai [1 ]
机构：
[1] College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu,610065, China
[2] Nanjing Marine Radar Institute, Nanjing,210014, China
来源：
ACS Applied Materials and Interfaces | 2023年
关键词：
Engineering Village;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Bond line thickness - Dry contact - On demands - Out-of-plane - Polymer composite - Sandwiched structure - Thermal impedance - Thermal interface materials - Thermal transport - Transport applications
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