Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions

被引：0
|
作者：
Depiver, Joshua A. [1 ]
Mallik, Sabuj [1 ]
Amalu, Emeka H. [2 ]
机构：
[1] School of Mechanical Engineering & the Built Environment, College of Engineering & Technology University of Derby, Markeaton Street, Derby,DE22 3AW, United Kingdom
[2] Department of Engineering, School of Computing, Engineering and Digital Technologies, Teesside University, Middlesbrough, Tees Valley, TS1 3BA, United Kingdom
来源：
Engineering Failure Analysis | 2021年 / 125卷
关键词：
538.1.1 Soldering - 546.1 Lead and Alloys - 546.2 Tin and Alloys - 714.2 Semiconductor Devices and Integrated Circuits - 921 Mathematics - 931.1 Mechanics - 951 Materials Science - 961 Systems Science;
D O I：
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学科分类号：
摘要：
128
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