Thermal fatigue life prediction of solder joints of plastic ball grid array packages

被引：1
|
作者：
Chu, Yin Fun [1 ]
Yi, Sung [1 ]
Geng, Phil [2 ]
机构：
[1] Mechanical and Material Engineering Department, Portland State University, Portland,OR,97207-0751, United States
[2] Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro,OR,97124, United States
来源：
International Journal of Materials and Structural Integrity | 2014年 / 8卷 / 1-3期
关键词：
D O I：
10.1504/IJMSI.2014.064769
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：3 / 20
相关论文
共 50 条
  • [1] Analytical Fatigue Life Prediction of Ball Grid Array Solder Joints
    Iulia–Eliza Ţinca
    Arjana Davidescu
    [J]. Journal of Electronic Materials, 2023, 52 : 7991 - 8000
  • [2] Analytical Fatigue Life Prediction of Ball Grid Array Solder Joints
    Tinca, Iulia-Eliza
    Davidescu, Arjana
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (12) : 7991 - 8000
  • [3] Enhancing solder joint fatigue life for ball grid array packages
    Wei, Z
    Kuan, LB
    [J]. PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 701 - 706
  • [4] Thermal-fatigue life prediction equation for plastic ball grid array (PBGA) SnAgCu lead-free solder joints
    Lau, John
    Lee, S. W. Ricky
    Song, Fubin
    Shangguan, Dongkai
    Lau, Dennis C.
    Dauksher, Walter
    [J]. ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 1013 - 1019
  • [5] Application of Response Surface Methods in Lead-free Solder Joints of Plastic Ball Grid Array Thermal Fatigue Life Prediction
    Qiang, Zhao
    Zhou, Dejian
    [J]. 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 842 - 845
  • [6] A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints
    Helin Wei
    Kuisheng Wang
    [J]. Journal of Electronic Materials, 2011, 40 : 2314 - 2319
  • [7] A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints
    Wei, Helin
    Wang, Kuisheng
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (11) : 2314 - 2319
  • [8] Significance of design parameters on the thermal fatigue life of plastic ball grid array packages
    Syed, AR
    [J]. 1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS, 1996, 2794 : 161 - 166
  • [9] Solder ball failure mechanisms in plastic ball grid array packages
    Zhong, CH
    Yi, S
    Whalley, DC
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2002, 14 (02) : 40 - 50
  • [10] Solder joint reliability of plastic ball grid array packages
    Zhong, CH
    Yi, S
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 1999, 11 (01) : 44 - 48
12345