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PEEC Modeling in 3D IC/Packaging Applications Based on Layered Green's Functions

被引：2
|
作者：
Zhao, Biyao [1 ]
Bai, Siqi [1 ]
Fan, Jun [1 ]
Achkir, Brice [2 ]
Ruehli, Albert [1 ]
机构：
[1] Missouri University of Science and Technology, Rolla,MO,65401, United States
[2] Cisco Systems, Inc., San Jose,CA,95134, United States
来源：
IEEE Transactions on Signal and Power Integrity | 2023年 / 2卷
关键词：
D O I：
10.1109/TSIPI.2023.3244893
中图分类号：
学科分类号：
摘要：
32
引用
收藏
页码：23 / 31
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