Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding

被引：0
|
作者：
Zhang, Yu [1 ]
Kang, Renke [1 ]
Gao, Shang [1 ]
Huang, Jinxing [1 ]
Zhu, Xianglong [1 ]
机构：
[1] Key Laboratory for Precision and Non-traditional Machining Technology, the Ministry of Education, Dalian University of Technology, Dalian,116024, China
来源：
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2023年 / 59卷 / 03期
关键词：
Engineering Village;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
'Dry' [ - Grinding burn - Grinding performance - Grinding process - Material removal mechanisms - Mechanical - Mechanical chemical grinding - Soft abrasive grinding wheel - Sub-surface damage - Water resistant
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页码：328 / 336
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