Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding

被引：0

作者：

Zhang, Yu ^{[1
]}

Kang, Renke ^{[1
]}

Gao, Shang ^{[1
]}

Huang, Jinxing ^{[1
]}

Zhu, Xianglong ^{[1
]}

机构：

[1] Key Laboratory for Precision and Non-traditional Machining Technology, the Ministry of Education, Dalian University of Technology, Dalian,116024, China

来源：

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2023年 / 59卷 / 03期

关键词：

Engineering Village;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

'Dry' [ - Grinding burn - Grinding performance - Grinding process - Material removal mechanisms - Mechanical - Mechanical chemical grinding - Soft abrasive grinding wheel - Sub-surface damage - Water resistant

引用

页码：328 / 336

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