Building 3D integrated circuits with electronics and photonics

被引：0
|
作者：
Xiang, Chao [1 ]
Bowers, John E. [2 ]
机构：
[1] Univ Hong Kong, Dept Elect & Elect Engn, Hong Kong, Peoples R China
[2] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA USA
来源：
NATURE ELECTRONICS | 2024年 / 7卷 / 06期
关键词：
D O I：
10.1038/s41928-024-01187-z
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.
引用
收藏
页码：422 / 424
页数：3
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