LOW-TEMPERATURE GETTERING OF CU, AG, AND AU ACROSS A WAFER OF SI BY AL

被引:65
|
作者
THOMPSON, RD
TU, KN
机构
关键词
D O I
10.1063/1.93565
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:440 / 442
页数:3
相关论文
共 50 条
  • [31] LOW-TEMPERATURE SPECIFIC HEATS OF ALLOYS BASED ON NOBLE METALS CU AG AND AU - ALPHA PHASE AG-SN ALLOYS
    MASSALSKI, TB
    ISAACS, LL
    PHYSICAL REVIEW, 1965, 138 (1A): : A139 - +
  • [32] LASER GETTERING AND ITS APPLICATION TO LOW-TEMPERATURE PROCESS
    HAYAFUJI, Y
    YANADA, T
    AOKI, Y
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) : C359 - C359
  • [33] LOW-TEMPERATURE WAFER DIRECT BONDING
    TONG, QY
    CHA, GH
    GAFITEANU, R
    GOSELE, U
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1994, 3 (01) : 29 - 35
  • [34] Wafer bonding by low-temperature soldering
    Lee, C
    Huang, WF
    Shie, JS
    SENSORS AND ACTUATORS A-PHYSICAL, 2000, 85 (1-3) : 330 - 334
  • [35] Passivation Effects on Low-Temperature Gettering in Multicrystalline Silicon
    Al-Amin, Mohammad
    Murphy, John D.
    IEEE JOURNAL OF PHOTOVOLTAICS, 2017, 7 (01): : 68 - 77
  • [36] AUGER-SPECTROSCOPY MEASUREMENT OF LOW-TEMPERATURE AG DIFFUSION IN AU-AG COUPLES
    ABRAMOFF, M
    DOBISZ, L
    LAGALLY, MG
    CLEMETSON, D
    HORNBOSTEL, L
    KUCKUK, J
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) : C348 - C348
  • [37] Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding
    Chen, Y. J.
    Chang, C. C.
    Lin, H. Y.
    Hsu, S. C.
    Liu, C. Y.
    MICROELECTRONICS RELIABILITY, 2012, 52 (02) : 381 - 384
  • [38] LOW-TEMPERATURE, FLUX-INDEPENDENT EPITAXY IN AG/SI(111)
    ROOS, KR
    TRINGIDES, MC
    SURFACE SCIENCE, 1994, 302 (1-2) : 37 - 48
  • [39] LOW-TEMPERATURE CHARACTERIZATION OF AL-SI DIFFUSION KINETICS
    DUGAN, MP
    TSAKALAKOS, T
    SUPERLATTICES AND MICROSTRUCTURES, 1988, 4 (4-5) : 565 - 570
  • [40] LOW-TEMPERATURE SPECIFIC-HEAT OF CU3AU
    MARTIN, DL
    PHYSICS LETTERS A, 1972, A 39 (04) : 320 - &