YIELD VALUES IN THICK-FILM RHEOLOGY

被引：0

作者：

FRAIOLI, AV ^{[1
]}

机构：

[1] PLESSEY EMD,MELVILLE,NY 11746

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中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：48 / 50

页数：3

共 50 条

[1] RHEOLOGY OF PASTES IN THICK-FILM PRINTING
TREASE, RE
DIETZ, RL
[J]. SOLID STATE TECHNOLOGY, 1972, 15 (01) : 39 - &
[2] YIELD OPTIMIZATION IN THICK-FILM MANUFACTURING
KUAN, FY
YONG, P
HOON, SW
SHIN, YW
[J]. JOURNAL OF MECHANICAL WORKING TECHNOLOGY, 1988, 17 : 423 - 431
[3] CORRELATION BETWEEN THICK-FILM RESISTANCE VALUES
THORBJORNSEN, AR
DVORACK, MA
RIAD, A
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (02): : 138 - 143
[4] EFFECT OF WETTABILITY ON YIELD OF THICK-FILM PATTERNS
LO, WC
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1976, 55 (04): : 416 - 416
[5] THICK-FILM RESISTORS FOR HIGH-YIELD PROCESSING
SABA, H
STEIN, SJ
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1972, 51 (04): : 358 - &
[6] CHANGES IN THICK-FILM RESISTOR VALUES DUE TO SUBSTRATE FLEXURE
HOLMES, PJ
[J]. MICROELECTRONICS AND RELIABILITY, 1973, 12 (04): : 395 - 396
[7] THICK-FILM TECHNOLOGY
PRUDENZIATI, M
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 1991, 25 (1-3) : 227 - 234
[8] THICK-FILM CIRCUITS
ISERT, H
[J]. ELEKTROTECHNISCHE ZEITSCHRIFT B-AUSGABE, 1972, 24 (04): : 85 - &
[9] THICK-FILM TECHNOLOGY
OCONNELL, JA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1967, 4 (05): : 331 - &
[10] THICK-FILM TECHNOLOGY
FUNK, W
[J]. PHILIPS TECHNICAL REVIEW, 1975, 35 (05): : 144 - 150