CORRELATION BETWEEN THICK-FILM RESISTANCE VALUES

被引：2
|
作者：
THORBJORNSEN, AR [1 ]
DVORACK, MA [1 ]
RIAD, A [1 ]
机构：
[1] UNIV TOLEDO,DEPT ELECT ENGN,TOLEDO,OH 43606
来源：
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1977年 / 13卷 / 02期
关键词：
D O I：
10.1109/TPHP.1977.1135192
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：138 / 143
页数：6
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