COPPER THICK-FILM MATERIALS - A PERSPECTIVE

被引：0
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作者：
COX, JJ
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来源：
SOLID STATE TECHNOLOGY | 1980年 / 23卷 / 10期
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：150 / 152
页数：3
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