COPPER AND SILVER CONTAMINATION OF THICK-FILM GOLD SURFACES

被引：3

作者：

PANOUSIS, NT

机构：

来源：

THIN SOLID FILMS | 1979年 / 64卷 / 01期

关键词：

D O I：

10.1016/0040-6090(79)90540-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：41 / 45

页数：5

共 50 条

[1] A COMPARISON OF THE RELIABILITY OF COPPER AND PALLADIUM SILVER THICK-FILM CROSSOVERS
SUTHERLAND, RR
VIDELO, IDE
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04): : 676 - 682
[2] STATUS OF COPPER THICK-FILM HYBRIDS
PITKANEN, DE
CUMMINGS, JP
SPEERSCHNEIDER, CJ
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 141 - 146
[3] COPPER THICK-FILM MATERIALS - A PERSPECTIVE
COX, JJ
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 150 - 152
[4] SILVER-PALLADIUM THICK-FILM CONDUCTORS
WANG, SF
DOUGHERTY, JP
HUEBNER, W
PEPIN, JG
[J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1994, 77 (12) : 3051 - 3072
[5] THERMOCOMPRESSION BONDABILITY OF THICK-FILM GOLD - A COMPARISON TO THIN-FILM GOLD
PANOUSIS, NT
KERSHNER, RC
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (04): : 617 - 623
[6] HIGH-PERFORMANCE THICK-FILM GOLD CONDUCTORS
GETTY, RR
TAYLOR, BE
NEEDES, CRS
[J]. SOLID STATE TECHNOLOGY, 1983, 26 (10) : 163 - 168
[7] GOLD POWDER PRODUCTION FOR THICK-FILM ELECTRONIC APPLICATIONS
ARROWSMITH, DJ
LODGE, KJ
[J]. TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1987, 65 : 120 - 126
[8] ENVIRONMENTAL-EFFECTS ON COPPER THICK-FILM MICROCIRCUITS
PITKANEN, DE
SPEERSCHNEIDER, CJ
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (03): : 250 - 256
[9] SINTERING OF THICK-FILM COPPER METALLURGY - A THERMOCHEMICAL VIEW
MASTER, RN
HERRON, LW
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (03): : 378 - 378
[10] SURFACE TREATMENTS AND BONDABILITY OF COPPER THICK-FILM CIRCUITS
LIU, TS
PITKANEN, DE
MCIVER, CH
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 417 - 424

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