REACTIVE ION ETCHING OF SILICON WITH CL2-AR

被引:0
|
作者
POGGE, HB
BONDUR, JA
BURKHARDT, PJ
机构
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C470 / C470
页数:1
相关论文
共 50 条
  • [21] Reactive ion etching of Si SiGe in CF4/Ar and Cl2/BCl3/Ar discharges
    Chang, SJ
    Juang, YZ
    Nayak, DK
    Shiraki, Y
    MATERIALS CHEMISTRY AND PHYSICS, 1999, 60 (01) : 22 - 27
  • [22] Evaluating the wall-recombination constant of Cl atoms in Cl2-Ar plasmas of different Ar percentage
    Kirillov Yu.V.
    Sitanov D.V.
    Russian Microelectronics, 2005, 34 (4) : 217 - 221
  • [23] Observations on the chemistry and physics of STI etch in Cl2-Ar plasmas
    Werbaneth, P
    Almerico, J
    SOLID STATE TECHNOLOGY, 2000, 43 (12) : 87 - +
  • [24] INVESTIGATIONS OF DRY ETCHING IN ALGAINP/GAINP USING CCL2F2/AR REACTIVE ION ETCHING AND AR ION-BEAM ETCHING
    HOMMEL, J
    MOSER, M
    GEIGER, M
    SCHOLZ, F
    SCHWEIZER, H
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1991, 9 (06): : 3526 - 3529
  • [25] Deep reactive ion etching of silicon
    Ayón, AA
    Chen, KS
    Lohner, KA
    Spearing, SM
    Sawin, HH
    Schmidt, MA
    MATERIALS SCIENCE OF MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES, 1999, 546 : 51 - 61
  • [26] REACTIVE ION ETCHING OF ALUMINUM SILICON
    LIGHT, RW
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (11) : 2225 - 2230
  • [27] REACTIVE ION ETCHING OF SILICON DIOXIDE
    LIGHT, RW
    SEE, FC
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1982, 184 (SEP): : 102 - INOR
  • [28] REACTIVE ION ETCHING OF SILICON DIOXIDE
    LIGHT, RW
    SEE, FC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (05) : 1152 - 1154
  • [29] ANGLED ETCHING OF GAAS/ALGAAS BY CONVENTIONAL CL-2 REACTIVE ION ETCHING
    TAKAMORI, T
    COLDREN, LA
    MERZ, JL
    APPLIED PHYSICS LETTERS, 1988, 53 (25) : 2549 - 2551
  • [30] ICP etching of III-nitride based laser structure with Cl2-Ar plasma assisted by Si coverplate material
    Zhirnov, E
    Stepanov, S
    Gott, A
    Wang, WN
    Shreter, YG
    Tarkhin, DV
    Bochkareva, NI
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2005, 23 (04): : 687 - 692