HIGH-THROW COPPER PLATING BATH

被引：0
|
作者：
不详
机构：
来源：
INDUSTRIAL FINISHING | 1977年 / 53卷 / 12期
关键词：
D O I：
暂无
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：42 / 44
页数：3
相关论文
共 50 条
  • [31] STRUCTURES OF COPPER(II) COMPLEXES WHICH DEPOSIT COPPER IN CHEMICAL COPPER-PLATING BATH
    OHNO, S
    BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN, 1978, 51 (10) : 3101 - 3102
  • [32] Influences of bath chemistry and complexing agent on plating rate in electroless copper methane sulphonate bath
    Kumaran, T. Manikanda
    Jothilakshmi, S.
    Rekha, S.
    JOURNAL OF THE INDIAN CHEMICAL SOCIETY, 2020, 97 (11B) : 2427 - 2432
  • [33] PLATING BATH IS MONITORED BY BATH USAGE
    BALMER, T
    DESIGN NEWS, 1970, 25 (09) : 76 - +
  • [34] INFLUENCE OF CURRENT REVERSALS ON THE THROWING POWER OF A SULFATE COPPER PLATING BATH
    KRUGLIKOV, SS
    YARLYKOV, MM
    YURCHUK, TE
    SOVIET ELECTROCHEMISTRY, 1991, 27 (03): : 269 - 273
  • [35] New plating bath for electroless copper deposition on sputtered barrier layers
    Lantasov, Y
    Palmans, R
    Maex, K
    MICROELECTRONIC ENGINEERING, 2000, 50 (1-4) : 441 - 447
  • [36] A Study of Low Temperature and Low Stress Electroless Copper Plating Bath
    Li, Li-Sha
    Li, Xi-Rong
    Zhao, Wen-Xia
    Ma, Qian
    Lu, Xu-Bin
    Wang, Zeng-Lin
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2013, 8 (04): : 5191 - 5202
  • [37] Development of a non-cyanide alkaline bath for industrial copper plating
    Tharamani, CN
    Maruthi, BN
    Mayanna, SM
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2002, 80 : 37 - 39
  • [38] A review of acid copper plating bath life extension & copper recovery from acid copper baths
    Bless, D
    PLATING AND SURFACE FINISHING, 2001, 88 (10): : 58 - 63
  • [39] SELECTIVE PULSE PLATING FROM AN ACID COPPER-SULFATE BATH
    VILAMBI, NRK
    CHIN, DT
    PLATING AND SURFACE FINISHING, 1988, 75 (01): : 67 - 73
  • [40] New electroless copper plating bath using sodium hypophosphite as reductant
    Yuan, X. L.
    Gao, J.
    Yang, Z. F.
    Wang, Z. X.
    Wang, Z. L.
    SURFACE ENGINEERING, 2012, 28 (05) : 377 - 381
12345