EFFECT OF GRAIN-BOUNDARY FAILURE ON FATIGUE LIFE OF HIGH-LEAD SN-PB SOLDER

被引：1
|
作者：
VAYNMAN, S
FINE, ME
机构：
[1] Department of Materials Science and Engineering, Northwestern University, Evanston
来源：
SCRIPTA METALLURGICA ET MATERIALIA | 1990年 / 24卷 / 09期
关键词：
D O I：
10.1016/0956-716X(90)90538-R
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：1737 / 1739
页数：3
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