EFFECT OF GRAIN-BOUNDARY FAILURE ON FATIGUE LIFE OF HIGH-LEAD SN-PB SOLDER

被引：1
|
作者：
VAYNMAN, S
FINE, ME
机构：
[1] Department of Materials Science and Engineering, Northwestern University, Evanston
来源：
SCRIPTA METALLURGICA ET MATERIALIA | 1990年 / 24卷 / 09期
关键词：
D O I：
10.1016/0956-716X(90)90538-R
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：1737 / 1739
页数：3
相关论文
共 50 条
  • [21] Effect of stress and strain state on heterogeneous coarsening in Sn-Pb solder
    Woodmansee, MW
    Neu, RW
    ACTA MATERIALIA, 2006, 54 (01) : 197 - 207
  • [22] Low cycle fatigue behavior and mechanisms of a eutectic Sn-Pb solder 63Sn/37Pb
    Kanchanomai, C
    Miyashita, Y
    Mutoh, Y
    INTERNATIONAL JOURNAL OF FATIGUE, 2002, 24 (06) : 671 - 683
  • [23] EFFECT OF CURRENT ON FATIGUE LIFE OF 60SN-40PB SOLDER
    VAYNMAN, S
    FINE, ME
    JEANNOTTE, DA
    SCRIPTA METALLURGICA ET MATERIALIA, 1992, 26 (06): : 999 - 1000
  • [24] GRAIN-BOUNDARY DIFFUSION IN SOME PB-SN ALLOYS
    OBERSCHMIDT, J
    KIM, KK
    GUPTA, D
    JOURNAL OF APPLIED PHYSICS, 1982, 53 (08) : 5672 - 5677
  • [25] Power cycling thermal fatigue of Sn-Pb solder joints on a chip scale package
    Towashiraporn, P
    Gall, K
    Subbarayan, G
    McIlvanie, B
    Hunter, BC
    Love, D
    Sullivan, B
    INTERNATIONAL JOURNAL OF FATIGUE, 2004, 26 (05) : 497 - 510
  • [26] Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water
    D. Q. Yu
    W. Jillek
    E. Schmitt
    Journal of Materials Science: Materials in Electronics, 2006, 17 : 219 - 227
  • [27] Effect of Cu on Interfacial Reaction in High-lead Solder Bumps
    Xu, Liwei
    Huang, Mingliang
    Yao, Quanbin
    Wang, Yong
    Lian, Binhao
    2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [28] Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water
    Yu, DQ
    Jillek, W
    Schmitt, E
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2006, 17 (03) : 219 - 227
  • [29] Study on the interfaces between copper alloys for lead frame and Sn-Pb solder alloys
    Wang, Q
    Lee, SWR
    Cao, YW
    Ma, JS
    PROCEEDINGS OF INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2000, : 388 - 390
  • [30] Wetting and Interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder
    Islam, MN
    Chan, YC
    2005 INTERNATIONAL CONFERENCE ON ASIAN GREEN ELECTRONICS: DESIGN FOR MANUFACTURABILITY AND RELIABILITY, PROCEEDINGS, 2004, : 178 - 184
12345