THYRISTOR WIRING MODEL IN MODULE TECHNOLOGY

被引:0
|
作者
HUSCH, W
机构
来源
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:52 / &
相关论文
共 50 条
  • [31] THYRISTOR MODELING FOR CAD AND SIMULATION OF THYRISTOR CIRCUITS BASED ON THE DERIVED MODEL.
    Murakami, Yoshishige
    Nishimura, Masataro
    [J]. Proceedings - IEEE International Symposium on Circuits and Systems, 1979, : 116 - 119
  • [32] Overview of thyristor module parameters for fast static VAr compensation available on the market
    Novak, Miroslav
    Ringelhan, Pavel
    Kukacka, Leos
    [J]. 2020 21ST INTERNATIONAL SCIENTIFIC CONFERENCE ON ELECTRIC POWER ENGINEERING (EPE), 2020, : 111 - 116
  • [33] A PSPICE MODEL FOR THE MOS CONTROLLED THYRISTOR
    YUVARAJAN, S
    QUEK, D
    [J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 1995, 42 (05) : 554 - 558
  • [34] Key technology of DC controllable arrester based on thyristor
    Liu, Lei
    Zhang, Xiang
    Wang, Dechang
    Ding, Fengfeng
    Chen, Yuanjun
    Fang, Taixun
    Huang, Hua
    [J]. Dianli Zidonghua Shebei/Electric Power Automation Equipment, 2022, 42 (09): : 183 - 188
  • [35] Development of a simple analytical model to quantify the PV module cost premium associated with module efficiency and cell technology
    Kang, Moon Hee
    Rohatgi, Ajeet
    Ristow, Alan
    [J]. RENEWABLE & SUSTAINABLE ENERGY REVIEWS, 2014, 37 : 380 - 385
  • [36] SUBMICROMETER GOLD INTERCONNECT WIRING BY SIDEWALL ELECTROPLATING TECHNOLOGY
    HIRANO, M
    AOYAMA, S
    YAMASAKI, K
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1994, 33 (4A): : L553 - L555
  • [37] COUPLING CORE COMPETENCES - WIRING INFORMATION TECHNOLOGY INTO THE BUSINESS
    LEHMANN, HP
    [J]. BUSINESS PROCESS RE-ENGINEERING: INFORMATION SYSTEMS OPPORTUNITIES AND CHALLENGES, 1994, 54 : 377 - 385
  • [38] Research on wiring technology of electronic complete machine interconnection
    Liu, Zhen-yu
    [J]. ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 558 - 558
  • [39] Development of the wiring diagram of the device based on the LoRa module RAK3172
    Makhanov, K. M.
    Kurmanaliyev, N. B.
    Musepov, S. B.
    Naptalov, A. K.
    Kenzhalieva, K. Z.
    [J]. BULLETIN OF THE UNIVERSITY OF KARAGANDA-PHYSICS, 2022, 4 (108): : 48 - 55
  • [40] A study on wiring pattern design for intelligent SiC power module with PEEC method
    Masuda, Eisuke
    Ibuchi, Takaaki
    Funaki, Tsuyoshi
    Otake, Hirotaka
    Miyazaki, Tatsuya
    Kanetake, Yasuo
    Nakamura, Takashi
    [J]. 2017 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2017, : 213 - 215