共 50 条
- [36] Hillock formation during electromigration in Cu and Al thin films: three-dimensional grain growth Applied Physics Letters, 1995, 66 (10):
- [38] Hillock formation during electromigration in Cu and Al thin films: Three-dimensional grain growth 1600, American Institute of Physics Inc. (66):
- [39] Cu and dilute binary Cu(Ti), Cu(Sn) and Cu(Al) thin films: Texture, grain growth and resistivity MAGNETIC AND ELECTRONIC FILMS-MICROSTRUCTURE, TEXTURE AND APPLICATION TO DATA STORAGE, 2002, 721 : 61 - 66