METALLIZATIONS ON LOW PERMITTIVITY SUBSTRATES FOR PACKAGING VLSI DEVICES

被引：0

作者：

DAS, A ^{[1
]}

RUZYLLO, J ^{[1
]}

CROSS, LE ^{[1
]}

MESSIER, R ^{[1
]}

机构：

[1] PENN STATE UNIV,MAT RES LAB,UNIVERSITY PK,PA 16802

来源：

关键词：

D O I：

暂无

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：C123 / C123

页数：1

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