METALLIZATIONS ON LOW PERMITTIVITY SUBSTRATES FOR PACKAGING VLSI DEVICES

被引：0
|
作者：
DAS, A [1 ]
RUZYLLO, J [1 ]
CROSS, LE [1 ]
MESSIER, R [1 ]
机构：
[1] PENN STATE UNIV,MAT RES LAB,UNIVERSITY PK,PA 16802
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1988年 / 135卷 / 03期
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D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
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页码：C123 / C123
页数：1
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