A DIELECTRICALLY ISOLATED PHOTODIODE ARRAY BY SILICON-WAFER DIRECT BONDING

被引:20
|
作者
OHURA, J
TSUKAKOSHI, T
FUKUDA, K
SHIMBO, M
OHASHI, H
机构
关键词
D O I
10.1109/EDL.1987.26692
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:454 / 456
页数:3
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