Novel preparation of P-N junction mesa diodes by silicon-wafer direct bonding (SDB)

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[1] Yeh, Ching-Fa
[2] Hwangleu, Shyang
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Yeh, Ching-Fa | 1600年 / 31期
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537 Heat Treatment - 712 Electronic and Thermionic Materials - 714 Electronic Components and Tubes - 802 Chemical Apparatus and Plants; Unit Operations; Unit Processes;
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