SOLDERING WITH LASERS IN ELECTRONIC CIRCUIT PRODUCTION

被引：0

作者：

不详

机构：

来源：

CONTROL AND INSTRUMENTATION | 1979年 / 11卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：11 / 11

页数：1

共 50 条

[41] OPTIMIZATION OF THE REQUIRED TEMPERATURE OF CONTACT SOLDERING OF ELECTRONIC DEVICES
Shtennikov, V. N.
Seleznev, V. D.
[J]. JOURNAL OF ENGINEERING PHYSICS AND THERMOPHYSICS, 2013, 86 (05) : 1060 - 1065
[42] Lasers in Electronic Warfare
Manke, Gerald C., II
[J]. 2011 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2011,
[43] Lasers in Electronic Warfare
Manke, Gerald C., II
[J]. TECHNOLOGIES FOR OPTICAL COUNTERMEASURES XI AND HIGH-POWER LASERS 2014: TECHNOLOGY AND SYSTEMS, 2014, 9251
[44] Electronic Soldering Materials Manufacturer Honored for Technical Paper
不详
[J]. WELDING JOURNAL, 2015, 94 (11) : 12 - 12
[45] Automated adaptive control of the reflow soldering of electronic assemblies
Conway, PP
Whalley, DC
Wilkinson, M
Williams, DJ
[J]. TWENTY FIRST IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1997, : 229 - 236
[46] THERMAL-BEHAVIOR OF ELECTRONIC COMPONENTS DURING SOLDERING
WASSINK, RJK
[J]. PHILIPS TECHNICAL REVIEW, 1979, 38 (4-5): : 135 - 142
[47] Electronic packaging - Laser soldering changes chip packaging
Brinkmann, U
[J]. LASER FOCUS WORLD, 1998, 34 (03): : 24 - +
[48] The finite element modelling of laser soldering for electronic assemblies
Beckett, PM
Fleming, AR
Gilbert, JM
Whitehead, DG
[J]. INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS, 2002, 15 (03) : 265 - 281
[49] Optimization of the required temperature of contact soldering of electronic devices
Shtennikov V.N.
Seleznev V.D.
[J]. Shtennikov, V.N. (Shtennikov_vn@mail.ru), 1600, Springer Science and Business Media, LLC (86): : 1060 - 1065
[50] THERMAL-BEHAVIOR OF ELECTRONIC COMPONENTS DURING SOLDERING
KLEINWASSINK, RJ
[J]. WELDING AND METAL FABRICATION, 1980, 48 (01): : 66 - 71

← 1 2 3 4 5 →