TRACKING ADVANCES IN AUTOMATIC EUTECTIC DIE-ATTACH SYSTEMS

被引:0
|
作者
JONES, G
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:34 / 35
页数:2
相关论文
共 50 条
  • [41] Effect of Sintering Environment on Silver-Copper Die-Attach Nanopaste
    Tan, Kim Seah
    Cheong, Kuan Yew
    2014 IEEE 36TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2015,
  • [42] Recent advances in die attach film
    Lo, Frederick
    Amigh, Richard
    Chung, Kevin
    Advancing Microelectronics, 2014, 41 (05): : 6 - 9
  • [43] Thermomechanical analysis of gold-based SiC die-attach assembly
    Meyyappan, K
    McCluskey, P
    Chen, LY
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2003, 3 (04) : 152 - 158
  • [44] Ecological comparison of soldering and sintering as die-attach technologies in power electronics
    Braunwarth, Louisa
    Amrhein, Sebastian
    Schreck, Timo
    Kaloudis, Michael
    JOURNAL OF CLEANER PRODUCTION, 2015, 102 : 408 - 417
  • [45] Theoretical and experimental Raman study for mechanical stress in die-attach process
    Uchida, Tomoyuki
    Masuyama, Takumi
    Sugie, Ryuichi
    Watanabe, Satoshi
    Microelectronics Reliability, 2021, 121
  • [46] Small Junction Temperature Cycles on Die-attach Solder Layer in IGBT
    Lai, Wei
    Chen, Minyou
    Ran, Li
    Xu, Shengyou
    Gao, Bing
    Jiang, Nan
    2015 17TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'15 ECCE-EUROPE), 2015,
  • [47] Theoretical and experimental Raman study for mechanical stress in die-attach process
    Uchida, Tomoyuki
    Masuyama, Takumi
    Sugie, Ryuichi
    Watanabe, Satoshi
    MICROELECTRONICS RELIABILITY, 2021, 121
  • [48] Design and Test of MEMS Resonant Accelerometer with a Novel Die-Attach Structure
    Ma, Yukun
    Wang, Shaohang
    Xu, Wenyi
    Zhang, Rong
    Han, Fengtian
    2023 IEEE SENSORS, 2023,
  • [49] Self-filleting technology using smart die-attach paste
    Forray, Debbie
    Furman, Ilya
    SOLID STATE TECHNOLOGY, 2009, 52 (09) : 16 - +
  • [50] Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material
    K. S. Siow
    S. T. Chua
    JOM, 2019, 71 : 3066 - 3075