LINK MONEY FOR COMPOSITES AND HIGH-SPEED MACHINERY

被引：0
|
作者：
不详
机构：
来源：
CHEMICAL ENGINEER-LONDON | 1989年 / 462期
关键词：
D O I：
暂无
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
引用
收藏
页码：10 / 10
页数：1
相关论文
共 50 条
  • [31] Fracture Analysis of Composites in High-speed Tension
    蒋持平
    曹利
    邹振祝
    王铎
    姚忠凯
    Journal of Materials Science & Technology, 1989, (06) : 430 - 433
  • [32] High-speed milling of wood composites with PCD
    Westkaemper, E.
    Fuss, M.
    Industrial Diamond Review, 1993, 53 (556):
  • [33] HIGH-SPEED OSCILLATING TESTS OF LUBRICATING COMPOSITES
    MARTIN, P
    MURPHY, GP
    LUBRICATION ENGINEERING, 1973, 29 (11): : 484 - 490
  • [34] High-Speed Link Analysis with System Identification Approach
    Choi, YongJin
    Cheng, Christopher
    2017 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY (EMCSI), 2017, : 741 - 744
  • [35] Simulation of a high-speed radio link under OPNET
    Carsenat, D
    Mathieu, S
    Besse, O
    Guedira, R
    Vaudon, P
    Monediere, T
    Jecko, B
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2001, 31 (01) : 24 - 27
  • [36] PRIVATE, HIGH-SPEED DIGITAL DATA LINK.
    Nuwer, John E.
    Brown, Samuel L.
    1975, : 1 - 4
  • [37] VIBRATORY RESPONSE OF A SANDWICH LINK IN A HIGH-SPEED MECHANISM
    ELDANNANH, EH
    FARGHALY, SH
    MECHANISM AND MACHINE THEORY, 1993, 28 (03) : 447 - 457
  • [38] High-speed link Verification Based on Statistical Inference
    Zeng, Xuan
    Fang, Chenlei
    Huang, Qicheng
    Yang, Fan
    Zhou, Dian
    Cai, Wei
    Shi, Weiping
    2016 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2016, : 906 - 909
  • [39] A novel receiver in high-speed serial data link
    Li, HL
    Mao, C
    Xiong, J
    Men, CY
    He, LN
    Yan, XL
    2003 5TH INTERNATIONAL CONFERENCE ON ASIC, VOLS 1 AND 2, PROCEEDINGS, 2003, : 623 - 626
  • [40] Transmission error measurement of high-speed transmission link
    Peng, DL
    Zhang, XH
    Liu, XK
    Zhu, G
    Yang, W
    PROCEEDINGS OF THE THIRD INTERNATIONAL SYMPOSIUM ON INSTRUMENTATION SCIENCE AND TECHNOLOGY, VOL 1, 2004, : 1302 - 1305
12345