CURRENT APPLICATIONS OF LOW-PRESSURE RF PLASMA TO THIN AND THICK-FILM TECHNOLOGIES

被引：0
|
作者：
JACOB, A [1 ]
机构：
[1] LFE CORP,PROC CONTROL DIV,EXCITED GAS R&D LAB,WALTHAM,MA 02145
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1973年 / 10卷 / 01期
关键词：
D O I：
10.1116/1.1317961
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：264 / &
相关论文
共 50 条
  • [41] THIN-FILM AND THICK-FILM SOLID IONIC DEVICES
    CHU, WF
    SOLID STATE IONICS, 1992, 52 (1-3) : 243 - 248
  • [42] THIN-FILM AND THICK-FILM DIAMOND GOES COMMERCIAL
    CARTS, YA
    LASER FOCUS WORLD, 1990, 26 (12): : 41 - 41
  • [43] THIN-FILM TECHNOLOGY - DIAMONDS AT LOW-PRESSURE
    ROY, R
    NATURE, 1987, 325 (6099) : 17 - 18
  • [44] Effects of pressure on PbTiO3 thin film prepared by low-pressure thermal plasma deposition
    Nagata, Shingo
    Wakiya, Naoki
    Shinozaki, Kazuo
    Masuda, Yoshio
    Mizutani, Nobuyasu
    Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, 1999, 63 (01): : 62 - 67
  • [45] Effects of pressure on PbTiO3 thin film prepared by low-pressure thermal plasma deposition
    Nagata, S
    Wakiya, N
    Shinozaki, K
    Masuda, Y
    Mizutani, N
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1999, 63 (01) : 62 - 67
  • [46] Boron carbide thin film surface characterization after graphitic carbon removal using low-pressure oxygen gas RF plasma
    Yadav, Praveen K.
    Gupta, Raj Kumar
    Gupta, Shruti
    Mukherjee, C.
    Goutam, U. K.
    Modi, Mohammed H.
    APPLIED OPTICS, 2023, 62 (05) : 1399 - 1405
  • [47] Plasma density control in a low-pressure RF resonant field
    Goto, N
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1998, 31 (04) : 428 - 433
  • [48] DC plasma potential pattern in low-pressure RF discharge
    Lisovsky, V.A.
    Krasnikov, O.V.
    IEEE International Conference on Plasma Science, 1995,
  • [49] Low-cost carbon thick-film strain sensors for implantable applications
    Gutierrez, Christian A.
    Meng, Ellis
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2010, 20 (09)
  • [50] APPLICATIONS OF LOW-TEMPERATURE RF PLASMA ETCHING TO THIN-FILM TECHNOLOGY
    JACOB, A
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (03) : C87 - C87
12345