ANALYSIS OF HIGH-TEMPERATURE SUPERCONDUCTORS FOR ELECTRONIC INTERCONNECTION APPLICATIONS

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作者：

FRYE, RC

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来源：

MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES | 1989年

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中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

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页码：369 / 374

页数：6

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