ANALYSIS OF HIGH-TEMPERATURE SUPERCONDUCTORS FOR ELECTRONIC INTERCONNECTION APPLICATIONS

被引：0
|
作者：
FRYE, RC
机构：
来源：
MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES | 1989年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：369 / 374
页数：6
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