ELECTRICAL CHARACTERISTICS OF COPPER POLYIMIDE THIN-FILM MULTILAYER INTERCONNECTS

被引：4
|
作者：
LANE, TA
BELCOURT, FJ
JENSEN, RJ
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 04期
关键词：
D O I：
10.1109/TCHMT.1987.1134780
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：577 / 585
页数：9
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