INTERACTION OF AL3TA INTERMETALLIC COMPOUND FILM WITH SI

被引：2
|
作者：
NOYA, A
SASAKI, K
UMEZAWA, T
机构：
来源：
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 1988年 / 27卷 / 12期
关键词：
D O I：
10.1143/JJAP.27.L2262
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：L2262 / L2264
页数：3
相关论文
共 50 条
  • [1] Interaction of Al3Ta intermetallic compound film with Si
    Noya, Atsushi
    Sasaki, Katsutaka
    Umezawa, Toshiji
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1988, 27 (12): : 2262 - 2264
  • [2] PREPARATION AND CHARACTERIZATIONS OF AL3TA INTERMETALLIC COMPOUND FILMS
    SASAKI, K
    NOYA, A
    UMEZAWA, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1988, 27 (07): : 1190 - 1192
  • [3] THE ELECTROCHEMICAL-BEHAVIOR OF THE AL3TA INTERMETALLIC COMPOUND AND PITTING IN 2-PHASE AL-TA ALLOYS
    BUCHHEIT, RG
    ZAVADIL, KR
    SCULLY, JR
    KNIGHT, TO
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (01) : 51 - 58
  • [4] Fabrication of the DO22-type intermetallic compound Al3Ta via powder metallurgy processes and its characterization
    Pak, H.R.
    Pak, J.S.L.
    Rigsbee, J.M.
    Wayman, C.M.
    Materials Science and Engineering A, 1990, A128 (01) : 129 - 139
  • [5] Effects of Al3Ta/TaN bilayered diffusion barriers in the Al/Si contact systems
    Takeyama, Mayumi
    Noya, Atsushi
    Sasaki, Katsutaka
    1996, JJAP, Minato-ku, Japan (35):
  • [6] STOICHIOMETRY OF TA-N FILM AND ITS APPLICATION FOR DIFFUSION BARRIER IN THE AL3TA/TA-N/SI CONTACT SYSTEM
    SASAKI, K
    NOYA, A
    UMEZAWA, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1990, 29 (06): : 1043 - 1047
  • [7] Stoichiometry of Ta-N film and its application for diffusion barrier in the Al3Ta/Ta-N/Si contact system
    Sasaki, Katsutaka, 1600, (29):
  • [8] FABRICATION OF THE DO22-TYPE INTERMETALLIC COMPOUND AL3TA VIA POWDER-METALLURGY PROCESSES AND ITS CHARACTERIZATION
    PAK, HR
    PAK, JSL
    RIGSBEE, JM
    WAYMAN, CM
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1990, 128 (01): : 129 - 139
  • [9] Effects of Al3Ta/TaN bilayered diffusion barriers in the Al/Si contact systems
    Takeyama, M
    Noya, A
    Sasaki, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (2A): : 699 - 703
  • [10] FP-LAPW investigation of the structural, electronic and thermodynamic properties of Al3Ta compound
    Boulechfar, R.
    Meradji, H.
    Chouahda, Z.
    Ghemid, S.
    Drablia, S.
    Khenata, R.
    INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2015, 29 (02):
12345