INTERACTION OF AL3TA INTERMETALLIC COMPOUND FILM WITH SI

被引:2
|
作者
NOYA, A
SASAKI, K
UMEZAWA, T
机构
关键词
D O I
10.1143/JJAP.27.L2262
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:L2262 / L2264
页数:3
相关论文
共 50 条
  • [41] Anodization of Al3Zr intermetallic compound film and its application to the preparation of thin-film capacitors with high reliability
    Inada, H
    Yamane, M
    Sasaki, K
    Abe, Y
    Kawamura, M
    Yanagisawa, H
    ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS, 2000, 83 (07): : 1 - 8
  • [42] Anodization of Al3Zr intermetallic compound film and its application to the preparation of thin-film capacitors with high reliability
    Inada, Haruhisa
    Yamane, Misao
    Sasaki, Katsutaka
    Abe, Yoshio
    Kawamura, Midori
    Yanagisawa, Hideto
    Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi), 2000, 83 (07): : 1 - 8
  • [43] ON UNSTABLE DIRECTIONS OF DISLOCATIONS IN THE INTERMETALLIC COMPOUND V3SI
    PAUFLER, P
    BOEHNKE, O
    CRYSTAL RESEARCH AND TECHNOLOGY, 1982, 17 (11) : 1405 - 1412
  • [44] DISORDERING OF THE NI3SI INTERMETALLIC COMPOUND BY MECHANICAL MILLING
    JANG, JSC
    TSAU, CH
    JOURNAL OF MATERIALS SCIENCE, 1993, 28 (04) : 982 - 988
  • [45] Enhanced densification of combustion synthesized Ni-Al intermetallic compound by Si addition
    Kimata, T
    Uenishi, K
    Ikenaga, A
    Kobayashi, KF
    INTERMETALLICS, 2003, 11 (09) : 947 - 952
  • [46] Intermetallic compound formation in Fe-Al-Si ternary system: Part II
    Maitra, T
    Gupta, SP
    MATERIALS CHARACTERIZATION, 2002, 49 (04) : 293 - 311
  • [48] INTERMETALLIC COMPOUND FORMATION IN THE NI3TA-NI3MO SECTION OF THE NI-TA-MO SYSTEM
    CHAKRAVORTY, S
    WEST, DRF
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1983, 2 (10) : 583 - 586
  • [49] Research on Fabrication and Tribological Properties of Ti-Al Intermetallic Compound Lubricate Film
    Zhang Ye
    Li Changsheng
    Tian Mingxia
    ADVANCED TRIBOLOGY, 2009, : 658 - 659
  • [50] Preparation of Ta2Al intermetallic compound films and their application as diffusion barriers to Cu penetration
    Kitami Inst of Technology, Kitami, Japan
    Thin Solid Films, 1-2 (6-11):