BONDING OF BEAM-LEAD INTEGRATED CIRCUITS

被引：0

|

作者：

HOWLAND, FL

CLARK, JE

ELEFTHER.MP

机构：

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1968年 / ED15卷 / 06期

关键词：

D O I：

10.1109/T-ED.1968.16268

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

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页码：421 / &

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