BONDING OF BEAM-LEAD INTEGRATED CIRCUITS

被引：0

作者：

HOWLAND, FL

CLARK, JE

ELEFTHER.MP

机构：

来源：

关键词：

D O I：

10.1109/T-ED.1968.16268

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：421 / &

共 50 条

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