CONCENTRATION IMPEDANCES STUDY OF A COPPER ELECTRODISSOLUTION MECHANISM

被引:1
|
作者
DIARD, JP
LECANUT, JM
MONTELLA, C
机构
关键词
D O I
10.1051/jcp/1994911552
中图分类号
Q5 [生物化学]; Q7 [分子生物学];
学科分类号
071010 ; 081704 ;
摘要
The concentration impedances of electrolyte species involved in an electro-chemical reaction taking place on a rotating disk electrode are not always classical convective diffusion impedances expressed as R th(taup)1/2/(taup)1/2. They are classical when the flux of the species at the interface is proportional to the faradaic current density. The concentration impedances of the electrolyte species are however more complicated when the structure of the reaction mechanism is such that this condition is not satisfied. A mechanism for the anodic dissolution of a metal, one of the simplest mechanisms presenting this property, has been investigated. For certain values of kinetic parameters and electrode potential, it is nevertheless possible to obtain impedance diagrams comprising an arc with a shape that is analogous to that of a convective diffusion impedance.
引用
收藏
页码:1552 / 1566
页数:15
相关论文
共 50 条
  • [41] IMPEDANCE MODEL FOR A CONCENTRATED-SOLUTION - APPLICATION TO THE ELECTRODISSOLUTION OF COPPER IN CHLORIDE SOLUTIONS
    TRIBOLLET, B
    NEWMAN, J
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (08) : C317 - C317
  • [42] Copper electrodissolution in 1 M HCl at low current densities. II. Electrochemical impedance spectroscopy study
    Diard, JP
    Le Canut, JM
    Le Gorrec, B
    Montella, C
    ELECTROCHIMICA ACTA, 1998, 43 (16-17) : 2485 - 2501
  • [43] Current oscillations during copper electrodissolution under solution sparging in acidic NaCl solutions
    Cui, Qingzhou
    Dewald, Howard D.
    MICROCHEMICAL JOURNAL, 2007, 86 (01) : 80 - 88
  • [44] RGB video electrochemistry of copper electrodeposition/electrodissolution in acid media on a ternary graphite: copper: polypropylene composite electrode
    Agrisuelas, J.
    Garcia-Jareno, J. J.
    Guillen, E.
    Vicente, F.
    ELECTROCHIMICA ACTA, 2019, 305 : 72 - 80
  • [45] Copper electrodissolution in 1 M HCl at low current densities. I. General steady-state study
    Diard, JP
    Le Canut, JM
    Le Gorrec, B
    Montella, C
    ELECTROCHIMICA ACTA, 1998, 43 (16-17) : 2469 - 2483
  • [46] MIXED-MODE OSCILLATIONS IN THE ELECTRODISSOLUTION OF COPPER IN ACETIC-ACID ACETATE BUFFER
    PARMANANDA, P
    DEWALD, HD
    ROLLINS, RW
    ELECTROCHIMICA ACTA, 1994, 39 (07) : 917 - 920
  • [47] Copper electrodissolution in 1 M HCl at low current densities. I. General steady-state study
    Domaine Universitaire, Saint Martin d'Heres, France
    Electrochim Acta, 16-17 (2469-2483):
  • [48] A new study of the problem of compatible impedances
    Youla, DC
    Winter, F
    Pillai, SU
    INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS, 1997, 25 (06) : 541 - 560
  • [49] Study of the Copper Electrodeposition Mechanism on Molybdenum Substrate
    Delbos, Elise
    El Belghiti, Hanane
    Mercier, Dimitri
    Vigneron, Jackie
    Bouttemy, Muriel
    Etcheberry, Arnaud
    ELECTRODEPOSITION FUNDAMENTALS AND NEW MATERIALS (GENERAL) - 222ND ECS MEETING/PRIME 2012: DIETER M. KOLB MEMORIAL SYMPOSIUM, 2013, 50 (52): : 95 - 101
  • [50] Influence of the sulphuric acid concentration on the kinetics and mechanism of silver ion cementation on copper
    Sulka, GD
    Jaskula, A
    HYDROMETALLURGY, 2005, 77 (1-2) : 131 - 137