SMD SOLDERING TECHNOLOGY DEVELOPMENT

被引：0
|
作者：
PAI, DK
机构：
来源：
WELDING JOURNAL | 1987年 / 66卷 / 10期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：51 / 59
页数：9
相关论文
共 50 条
  • [41] Soldering technology for area array packages
    Lee, NC
    Casey, W
    [J]. SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 282 - 297
  • [42] Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering
    Geczy, Attila
    Szalmasi, Daniel
    Straubinger, Daniel
    Illes, Balazs
    [J]. 2019 IEEE 25TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2019), 2019, : 343 - 346
  • [43] SMD PRINTED-CIRCUIT BOARD MODULES DESIGN ASSEMBLY SOLDERING SYSTEMS SOLDER RESIST MASKS
    WEINHOLD, M
    [J]. F&M-FEINWERKTECHNIK & MESSTECHNIK, 1988, 96 (05): : 197 - 200
  • [44] An Analysis of VOC-free fluxes and lead-free solders application in a manual SMD soldering
    Tesarski, Sebastian J.
    Urbanski, Krzysztof J.
    Platek, Bartosz T.
    [J]. PROCEEDINGS OF 2008 INTERNATIONAL STUDENTS AND YOUNG SCIENTIST WORKSHOP PHOTONICS AND MICROSYSTEMS, 2008, : 84 - 86
  • [45] Tool to Aid Production of Electronic Prototypes with SMD Technology
    Vega, A.
    Felipe, S.
    Monagas, J.
    Deniz, A.
    [J]. PROCEEDINGS OF 2016 TECHNOLOGIES APPLIED TO ELECTRONICS TEACHING (TAEE 2016), 2016,
  • [46] BRAZING AND SOLDERING AND PROSPECTS FOR THEIR DEVELOPMENT
    LOTSMANO.SN
    [J]. WELDING PRODUCTION, 1968, 15 (10): : 1 - &
  • [47] Development of a duothermal soldering process
    Consiglio, S.
    Fleschutz, T.
    Seliger, G.
    Seutemann, J.
    [J]. CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2006, 55 (01) : 33 - 36
  • [48] Reduced oxide soldering activation (ROSA): Enabling technology for soldering of flip chip assemblies
    Hillman, D
    [J]. 1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 586 - 591
  • [49] CONDENSATION SOLDERING PUTS A NATURAL PHENOMENON TO WORK IN A UNIQUE SOLDERING DEVELOPMENT
    PFAHL, RC
    MOLLENDORF, JC
    CHU, TY
    [J]. WELDING JOURNAL, 1975, 54 (01) : 22 - 25
  • [50] Development of Technology for Soldering Small-Diameter Pipelines from Aluminum Alloys and Dissimilar Materials
    Ponomarev, K. E.
    Stroganov, A. M.
    Strelnikov, I. V.
    [J]. SOLAR SYSTEM RESEARCH, 2020, 54 (07) : 730 - 734
12345