LASER DRILLING OF HIGH-DENSITY PRINTED-CIRCUIT BOARDS

被引:0
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作者
KLAUSER, HE [1 ]
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[1] IBM CORP,ENDICOTT,NY 13760
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TM [电工技术]; TN [电子技术、通信技术];
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0808 ; 0809 ;
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页码:160 / 160
页数:1
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