TWINNING IN COPPER ELECTRODEPOSITS

被引:6
|
作者
BARNES, SC
机构
来源
ACTA METALLURGICA | 1959年 / 7卷 / 10期
关键词
D O I
10.1016/0001-6160(59)90160-9
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:700 / 700
页数:1
相关论文
共 50 条
  • [41] THE ORIENTATION AND MORPHOLOGY OF LEAD-TIN-COPPER ELECTRODEPOSITS
    KIM, JS
    PYUN, SI
    LEE, HG
    PLATING AND SURFACE FINISHING, 1989, 76 (07): : 50 - 54
  • [42] DEVELOPMENT OF PREFERRED ORIENTATION IN COPPER ELECTRODEPOSITS BY CYCLIC STRESSING
    SUZUKI, M
    JOURNAL OF THE INSTITUTE OF METALS, 1964, 92 (05): : 141 - &
  • [43] The influence of pulse frequency on the hardness of bright copper electrodeposits
    Stoychev, DS
    Aroyo, MS
    PLATING AND SURFACE FINISHING, 1997, 84 (08): : 26 - 28
  • [44] On the physical quality of copper electrodeposits obtained on mesh cathodes
    Cifuentes, L.
    Mella, M.
    CANADIAN METALLURGICAL QUARTERLY, 2006, 45 (01) : 9 - 15
  • [45] Effects of sonication on the anodic dissolution of copper and nickel electrodeposits
    Chiba, Atsushi
    Metal Finishing, 2003, 101 (06) : 117 - 122
  • [46] PHYSICAL-PROPERTIES OF PULSED CURRENT COPPER ELECTRODEPOSITS
    KALANTARY, MR
    GABE, DR
    JOURNAL OF MATERIALS SCIENCE, 1995, 30 (18) : 4515 - 4522
  • [47] Fabrication of DC-plated nanocrystalline copper electrodeposits
    Seah, CH
    Mridha, S
    Chan, LH
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1999, 90 : 432 - 436
  • [48] A CATALYTIC METHOD OF DETERMINING THE POROSITY OF ELECTRODEPOSITS OF COPPER ON IRON
    FRANKLIN, TC
    MIRTSCHING, BC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (08) : C322 - C322
  • [49] Texture and temperature dependence on the mechanical characteristics of copper electrodeposits
    Song, Jenn-Ming
    Wang, Ding-Siang
    Yeh, Chung-Hsien
    Lu, Wei-Chih
    Tsou, Yung-Sheng
    Lin, Shi-Ching
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 559 : 655 - 664
  • [50] RELATIONSHIP BETWEEN INITIAL AND RECRYSTALLIZATION TEXTURES OF COPPER ELECTRODEPOSITS
    LEE, DN
    KANG, S
    YANG, J
    PLATING AND SURFACE FINISHING, 1995, 82 (03): : 76 - 79