共 50 条
- [41] Optimization and robust design of electronics assemblies under fracture, delamination and fatigue aspects [J]. EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 97 - +
- [42] Towards a robust design of electronics assemblies under fracture, delamination and fatigue aspects [J]. 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 476 - 481
- [43] FATIGUE FAILURE OF RUBBER-TO-RUBBER JOINTS [J]. JOURNAL OF ADHESION, 1992, 37 (04): : 225 - 237
- [45] RUBBER ELASTICITY AND FRACTURE [J]. JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 1988, 110 (03): : 258 - 265
- [50] MOLECULAR FRACTURE OF NATURAL RUBBER DURING TENSILE TESTS AT 113 DEGREES K [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1971, (NSEP): : 92 - &