PLASMA-ETCHING FOR SIO2 PROFILE CONTROL

被引：0
|
作者：
BONDUR, JA
CLARK, HA
机构：
来源：
SOLID STATE TECHNOLOGY | 1980年 / 23卷 / 04期
关键词：
Compendex;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
INTEGRATED CIRCUIT MANUFACTURE
引用
收藏
页码：122 / 128
页数：7
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