AUTOMATIC DEFECT CLASSIFICATION OF PRINTED WIRING BOARD SOLDER JOINTS

被引：9
|
作者：
DRIELS, MR [1 ]
NOLAN, DJ [1 ]
机构：
[1] TEXAS A&M UNIV SYST,DEPT MECH ENGN,COLLEGE STN,TX 77843
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1990年 / 13卷 / 02期
关键词：
D O I：
10.1109/33.56166
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this work, an automatic windowing algorithm is developed tor use in automatic printed wiring board solder joint inspection. The method uses Hough curve detection to locate the solder joint within the image. Eleven good features selected in previous work by Cheng-Cheng Lee for use in the solder joint inspection task are studied in detail for purposes of optimizing the inspection process. This is done with the aid of a minimum distance classification algorithm that allows for classification of the solder joint based on user selected features. Automatic windowing, feature selection, and classification algorithms are finally compiled into a complete solder joint inspection system. © 1990 IEEE
引用
收藏
页码：331 / 340
页数：10
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