PRESENT SITUATION AND TREND OF ELECTRONIC PACKAGING TECHNOLOGY

Nowadays, in the field of electronic appliances, the digital hand-held terminals, which meet the needs for 'multi-media' era, have become a major driving force of the technical challenges, such as the number of the LSI chip in a system, complexity and functionality of the circuit and compactness of the system. In the field of the semiconductor industries, quest for a path to develop a competitive devices with less investment in a short turn around time has become one of the major topics. These changes of the circumstances also affect the electronic packaging technology, which has a role to connect between these two fields. Matured SMT technique has been gradually replaced by 'bare-chip packaging' and 'system packaging'. This paper describes the outlook of these technical stream and surveys the state-of-the-art packaging technology.