FINITE TEMPERATURE LATTICE SOFTENING IN CESN3

被引:2
|
作者
CROFT, M [1 ]
MCGUIRE, T [1 ]
HERBER, RH [1 ]
机构
[1] RUTGERS STATE UNIV,DEPT CHEM,PISCATAWAY,NJ 08854
关键词
D O I
10.1016/0038-1098(82)90246-0
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
引用
收藏
页码:43 / 47
页数:5
相关论文
共 50 条
  • [41] COHERENCE EFFECTS AND 5D CONTRIBUTION TO THE MAGNETISM OF CE IN CESN3
    BOUCHERLE, JX
    FILLION, G
    FLOUQUET, J
    GIVORD, F
    LEJAY, P
    SCHWEIZER, J
    PHYSICA B, 1990, 163 (1-3): : 635 - 637
  • [42] HIGH-FIELD MAGNETORESISTANCE AND DEHAAS-VANALPHEN EFFECT IN CESN3
    UMEHARA, I
    KUROSAWA, Y
    NAGAI, N
    KIKUCHI, M
    SATOH, K
    ONUKI, Y
    JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, 1990, 59 (08) : 2848 - 2855
  • [43] Surface and bulk 4f electronic structure of CeIn3 and CeSn3
    Kumigashira, H
    Kim, HD
    Takahashi, T
    Sakai, O
    Kasaya, M
    Tjernberg, O
    Chiaia, G
    Duo, L
    Lindau, I
    JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 1998, 177 : 1035 - 1036
  • [44] OPTICAL-PROPERTIES AND ELECTRONIC-STRUCTURES OF CESN3 AND LASN3
    RHEE, JY
    HARMON, BN
    LYNCH, DW
    PHYSICAL REVIEW B, 1994, 50 (08): : 5693 - 5694
  • [45] PHONON-DISPERSION CURVES OF CESN3 IN THE VICINITY OF THE R-POINT
    PINTSCHOVIUS, L
    HOLLANDMORITZ, E
    WOHLLEBEN, D
    STAHR, S
    LIEBERTZ, J
    ASSMUS, W
    STASSIS, C
    LOONG, CK
    ZARESTKY, S
    NICKLOW, RM
    SOLID STATE COMMUNICATIONS, 1983, 47 (08) : 663 - 664
  • [47] Surface and bulk 4f-photoemission spectra of CeIn3 and CeSn3
    Kim, HD
    Tjernberg, O
    Chiaia, G
    Kumigashira, H
    Takahashi, T
    Duo, L
    Sakai, O
    Kasaya, M
    Lindau, I
    PHYSICAL REVIEW B, 1997, 56 (03): : 1620 - 1624
  • [48] Surface and bulk 4f electronic structure of CeIn3 and CeSn3
    Kumigashira, H.
    Kim, H.-D.
    Takahashi, T.
    Sakai, O.
    Kasaya, M.
    Tjernberg, O.
    Chiaia, G.
    Duo, L.
    Lindau, I.
    Journal of Magnetism and Magnetic Materials, 1998, 177-181 (Pt 2): : 1035 - 1036
  • [49] Transmission Electron Microscopy Investigations on the Growth of Tin Whiskers from CeSn3 Substrate
    Li, Cai-Fu
    Liu, Zhi-Quan
    Shang, Jian-Ku
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 904 - 907
  • [50] Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging
    Liang Zhang
    Lei Sun
    Ji-guang Han
    Yong-huan Guo
    Journal of Materials Science: Materials in Electronics, 2015, 26 : 6194 - 6197