RATIONAL MANUFACTURING OF PRINTED WIRING BOARDS

被引：0
|
作者：
BANNASCH, D
机构：
来源：
ELEKTROTECHNISCHE ZEITSCHRIFT B-AUSGABE | 1972年 / 24卷 / 24期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：626 / &
相关论文
共 50 条
  • [41] SIMPLIFIED WIRING IN AUTO PRINTED-CIRCUIT BOARDS
    不详
    [J]. ADHESIVES AGE, 1983, 26 (01): : 37 - 37
  • [42] INNER LAYER DEFECTS OF MULTILAYER PRINTED WIRING BOARDS
    GRAY, MW
    [J]. TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1989, 67 : 116 - 123
  • [43] Integral resistors in high frequency printed wiring boards
    [J]. Mahler, Bruce P., 2000, Horizon House, Norwood, MA, United States (43)
  • [44] Experimental determination of thermal conductivity of printed wiring boards
    Azar, K
    Graebner, JE
    [J]. TWELFTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS, 1996, : 169 - 182
  • [45] Integral resistors in high frequency printed wiring boards
    Mahler, P
    [J]. MICROWAVE JOURNAL, 2000, 43 (02) : 108 - +
  • [46] HIGH-PERFORMANCE MATERIALS FOR PRINTED WIRING BOARDS
    GUILES, CL
    [J]. PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 349 - 359
  • [47] Application of multiobjective optimization in selection of printed wiring boards
    Li, QS
    Palusinski, GA
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (04): : 425 - 432
  • [48] Recycling of printed wiring boards with mounted electronic parts
    Yokoyama, S
    Iji, M
    [J]. PROCEEDINGS OF THE 1997 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT - ISEE-1997, 1997, : 109 - 114
  • [49] Factors that influence ionic migration on printed wiring boards
    Reid, M
    Punch, J
    Rodgers, B
    Pomeroy, MJ
    Galkin, T
    Stenberg, T
    Rusanen, O
    Elonenc, E
    Vilen, M
    Vakevainen, K
    [J]. 2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL, 2005, : 300 - 304
  • [50] AN INTERACTIVE LAYOUT SYSTEM FOR ANALOG PRINTED WIRING BOARDS
    SAHARA, K
    KOBORI, K
    NISHIOKA, I
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (02): : 260 - 266
12345