BIASED HUMIDITY TESTING OF COPPER THICK-FILM CERAMIC PRINTED WIRING BOARDS

被引：0
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作者：
KITANO, PT
机构：
来源：
PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2 | 1989年
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：3 / 16
页数：14
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