LASER CUT MICROWAVE THIN-FILM CIRCUITS

被引：0

作者：

MINO, TD ^{[1
]}

OBERHOLZER, DJ ^{[1
]}

STRITTMATTER, CA ^{[1
]}

机构：

[1] WESTERN ELECT CO, ALLENTOWN, PA 18103 USA

来源：

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：37 / 40

页数：4

共 50 条

[1] TECHNOLOGY OF THIN-FILM HYBRID MICROWAVE CIRCUITS
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[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (04): : 304 - 309
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[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (04): : 309 - 316
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[J]. PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE, 1970, : 626 - +
[4] Microwave integrated circuits using thin-film BST
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[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1983, 10 (2-3): : 185 - 189
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[10] THIN-FILM HYBRID CIRCUITS
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